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  • image of System On Chip (SoC)>XC7Z030-2FBG676I
  • image of System On Chip (SoC)>XC7Z030-2FBG676I
Model XC7Z030-2FBG676I
Product Category System On Chip (SoC)
Manufacturer Xilinx (AMD)
Description IC SOC CORTEX-A
Encapsulation -
Package Tray
RoHS Status 1
Price: $449.8000
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image of System On Chip (SoC)>3925212
3925212
Model
3925212
Product Category
System On Chip (SoC)
Manufacturer
Xilinx (AMD)
Description
IC SOC CORTEX-A
Encapsulation
-
Package
Tray
lang_roHSStatusStatus
1
Product parameters
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesZynq®-7000
PackageTray
Product StatusACTIVE
Package / Case676-BBGA, FCBGA
Speed800MHz
RAM Size256KB
Number of I/O130
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A9 MPCore™ with CoreSight™
Primary AttributesKintex™-7 FPGA, 125K Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA
Supplier Device Package676-FCBGA (27x27)
ArchitectureMCU, FPGA
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